OEM&ODM

1. Demand diagnosis

(1-3 working days)

Establish a cross-departmental technical team (ID design/electronic engineering/structural engineering).
Use QFD quality function deployment model to transform customer needs.
Output "Product Definition Book" including performance parameters/certification requirements/cost budget three-dimensional confirmation.

2. Solution design

(3-7 working days)

Start DFM manufacturability design verification.
Provide three basic solutions for motherboard customization/cooling system/mold development.
Configure BOM list pre-examination and component replacement solution library.

3. Engineering verification

(5-10 working days)

3D printing prototype + CNC precision prototype dual-track verification.
Perform 23 basic tests such as drop/high and low temperature/EMC.
Issue "Engineering Verification Report" including rectification suggestions and mass production risk assessment.

4. Trial production introduction

(15-25 working days)

SMT fully automatic patch line + assembly line in parallel.
Implement real-time monitoring of process capability index (CPK).
Complete RoHS/CE/FCC and other target market mandatory certification.

5. Mass production guarantee

Multi-layer quality inspection and data monitoring and testing.

6. Delivery management

Each unit is carefully packaged to prevent falling.
Support diversified logistics solutions such as FOB/CIF/DDP.
Provide 72-hour arrival guarantee at major ports around the world.

7. After-sales support

7×24 hours online technical response.
Provide annual optimization solutions and hardware iteration suggestions.

1. SMT soldering

(surface mount technology)

Function: Precisely mount micro components such as chips, resistors, capacitors, etc. to the PCB motherboard, with a solder joint accuracy of ±0.01mm
Risk warning:

Uneven solder paste printing thickness → Leading to cold soldering/short circuit (defective rate increased by 30%+)

Patch coordinate offset → Cause BGA chip soldering failure (repair cost increased by 5 times)

2. Reflow soldering

Function: Reliable forming of solder alloy through 8-zone precision temperature control curve (up to 260℃±3℃)
Risk warning:

Peak temperature exceeds the standard → Component thermal damage (MLCC cracking risk ↑45%)

Improper cooling rate → Fragile solder joint lattice structure (drop test failure rate ↑60%)

3. PCBA functional test

Function: Using ICT needle bed + flying probe tester, 100% detection of circuit impedance/voltage/signal integrity
Risk warning:

Test coverage <95% → Potential short circuit risk flows into the assembly link (market repair rate ↑22%)

Poor probe contact → misjudgment of qualified products (quality cost loss $8/unit)

4. Injection molding

(housing manufacturing)

Function: Use magnesium-aluminum alloy mold with ±0.05mm accuracy to achieve 1.2mm ultra-thin wall thickness molding of the shell

Risk warning:

Mold temperature control deviation → surface shrinkage lines (appearance defect rate ↑35%)

Mold release agent residue → affect subsequent spray adhesion (coating peeling complaints ↑18%)

5. Whole machine assembly

Function: Ensure accurate assembly of screen hinge/interface module through torque sensor (0.2N·m accuracy)

Risk warning:

Failure of electrostatic protection → CMOS chip breakdown (out-of-box defect rate ↑15%)

Screw locking overload → stress cracking of plastic parts (3-month failure rate ↑12%)

6. Automated testing

(Burn-in =Test）

Function: 72 hours continuous load test (CPU/GPU full frequency operation + temperature cycle shock)
Risk warning:

Insufficient test time → Missing detection of hidden component defects (early failure rate ↑25%)

Missing voltage fluctuation simulation → Power adapter compatibility issues (customer complaints ↑30%)

7. Aging Test

Function: Simulating accelerated aging with 3 years of use intensity (85℃/85%RH extreme environment test for 48 hours)
Risk warning:

Humidity control deviation → Metal contact oxidation failure (poor interface contact ↑20%)

Unsufficient verification of cooling system → Risk of frequency reduction in long-term use (performance complaints ↑40%)

8. Final inspection packaging

(QC & Packaging)

Function: Implement ASTM D4169 transportation test standard, customize EPE/air column bag cushioning solution
Risk warning:

Insufficient drop test height → Logistics damage rate ↑18%

Desiccant does not meet the standard → Risk of mildew during shipping (return loss $15/unit)